Transition from ABF to develop Film/Liquid materials for different applications, specializing in FO-WLP/EMBEDDED/MUF grades
The product itself is black, and provides a lower Young modulus (Low modulus) and expansion coefficient (Low CTE) to improve the problem of warpage during packaging.
The production thickness of Film can be from 25um to 200um, and according to the product series, it has different material properties to meet the different structural needs of customers.
Production and processing can use Compression Molding/Lamination in two different ways.
Different from the original Molding material, Film can carry out the SAP semi-additive process and make lines on the material.
