Product Introduction
Ajinomoto Build-Up Film™ (ABF™) is a world-renowned insulating build-up material. It is the designated special material for many well-known American, Chinese and European chip manufacturers, and is widely used in FC-BGA/FC-CSP products.
The application of ABF™ can be seen from general home computers, server hosts, mobile phones, 5G-related communication application chips, etc. Therefore, based on the individual needs of customers, we can provide related products.
The production process of materials is in Japan, providing customers with long-term and stable quality.
For the needs of new generation products, such as Low CTE, Low loss, FLS, etc., we continue to work closely with end customers to develop.
ABF™ can also be attached to RCC.
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